1. HOME
  2. PCB
  3. Manufacturing Capability

Manufacturing Capability

Rigid PCB
Content Capability
Layer Count 26L
Line Width/Spacing (H/Hoz) 2.5/2.5mil (0.063mm)
Line Width/Spacing (1/1oz) 3/3mil (0.075mm)
Min. Hole size 6mil (0.15mm)
Aspect Ratio 16:1
Min. & Max. Board THK. 0.3mm ~ 6.0mm
Min. S/M Bridge 3mil (0.075mm)
CNC Tolerance +/- 2mil

 

HDI
Content Capability
Layer Count 20L
HDI Structure 3+N+3
Line Width/Spacing (H/Hoz) 2.5/2.5mil (0.063mm)
Line Width/Spacing (1/1oz) 3/3mil (0.075mm)
Min. laser VIA size 3mil (0.075mm)
Aspect Ratio 16:1
Bline hole A/R 1:1
Min. & Max. Board THK. 0.3mm ~ 4.0mm
聯絡我們留言