HorngCom offers leading-edge packaging technologies that deliver high performance, fast turnaround, and cost efficiency:

Wafer Level CSP: 20/20μm line/space capability or lower, ideal for high-density interconnects.

Bumping: Pb-free solder or ENIG/ENEPIG bumping options for compatibility and environmental compliance.

Embedded Die Package (FOiP / Fan-Out in Package): Combines compactness with high thermal and electrical performance.

High production throughput: Maximizing yield and minimizing lead-time at the lowest cost.